JPS62162875U - - Google Patents
Info
- Publication number
- JPS62162875U JPS62162875U JP4992386U JP4992386U JPS62162875U JP S62162875 U JPS62162875 U JP S62162875U JP 4992386 U JP4992386 U JP 4992386U JP 4992386 U JP4992386 U JP 4992386U JP S62162875 U JPS62162875 U JP S62162875U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- via holes
- lower electrode
- printed multilayer
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4992386U JPH0427184Y2 (en]) | 1986-04-03 | 1986-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4992386U JPH0427184Y2 (en]) | 1986-04-03 | 1986-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62162875U true JPS62162875U (en]) | 1987-10-16 |
| JPH0427184Y2 JPH0427184Y2 (en]) | 1992-06-30 |
Family
ID=30872821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4992386U Expired JPH0427184Y2 (en]) | 1986-04-03 | 1986-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427184Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013247357A (ja) * | 2012-05-29 | 2013-12-09 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 一体的階段状スタック構造体を備えた多層電子構造体 |
| JP2014003267A (ja) * | 2012-06-14 | 2014-01-09 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 段状の穴を備えた多層電子構造体 |
-
1986
- 1986-04-03 JP JP4992386U patent/JPH0427184Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013247357A (ja) * | 2012-05-29 | 2013-12-09 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 一体的階段状スタック構造体を備えた多層電子構造体 |
| JP2014003267A (ja) * | 2012-06-14 | 2014-01-09 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 段状の穴を備えた多層電子構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427184Y2 (en]) | 1992-06-30 |